iRobot’s Chapter 11 filing and planned acquisition by its manufacturing partner PICEA Robotics arrives alongside Vietnam’s rollout of new tax-incentive criteria for electronics projects.

Texas Instruments, Intel, AMD, and Mouser Electronics are facing lawsuits alleging their microchips ended up in Russian and Iranian weapons.

MIT researchers have demonstrated a method for fabricating a second layer of transistors directly on top of finished dies, offering a new pathway to boost chip density without shrinking process nodes.

Researchers reporting at IEDM 2025 say a long-assumed flaw in organic thin-film transistors, contact energy barriers, can actually stabilize current flow when precisely controlled.

Mycronic releases GenI generative AOI programming.

PCEA reports that PCB East 2026 exhibition space is more than 70% booked and on track to sell out, with the event moving to the DCU Center in Worcester for its April 28–May 1 conference and April 29 exhibition.

Entries for Circuits Assembly's 2026 NPI Awards, recognizing innovations in electronics assembly equipment, material and software, are due Dec. 19.

Cencorp debuts 1500 OF EVO 2 odd-form placement machine.

ASMPT launches SIPLACE V placement platform.

ASYS shows VEGO GenS Handler.

Mirtec shows TAL 3D Scan.

Mycronic launches MYPro A41DX, A41SX placement machines.

PCB West 2026 booth sales are now open to all exhibitors, with more than 60 percent of the floor already reserved following early access for returning companies.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Mycronic unveils BA 01 small dot jet printing ejector.

Vietnam’s Ministry of Science and Technology has issued a circular setting criteria for enterprises engaged in electronics manufacturing projects to qualify for tax incentives, aiming to lure more global electronics giants.

iRobot has filed for Chapter 11 and will be acquired by its longtime manufacturing partner, China-based Shenzhen PICEA Robotics.

Unitech expects low-Earth-orbit satellite business from Southeast Asia to contribute around 20% of its revenue in 2026.

Kitron secured a $18.5M contract to produce advanced electronic components for combat vehicle systems, with deliveries beginning in late 2026.

Mobius Materials has closed a $3M seed round to expand its authenticated semiconductor spot market.

Qualcomm has acquired Ventana Micro Systems to deepen its capabilities in RISC-V CPU technology.

Ecarx has partnered with Victory Giant Technology to scale production of high-performance automotive computing platforms

Summit Interconnect names Paul Cooke director of engineering.

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EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.