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BUSINESS NEWS
Japan will invest $21B in two GlobalFoundries chip factories in New York, with the first fab expected to launch in 2029.
Global smartphone shipments fell a record 22 percent YoY in Q3, according to preliminary IDC data. Analysts blame the AI-driven memory crisis.
Tenghui Electronics’ AI high-frequency, high-speed copper-clad laminate project held a signing ceremony in Kunshan this week. Once fully completed and operational, it is expected to achieve an annual output value of about 2 billion RMB ($300M).
Mergers and acquisitions activity among EMS companies improved in Q3 following a slower second quarter, with consolidation continuing to account for the majority of transactions.
Cicor Group posted a 6.7 percent increase in sales for the third quarter of 2026.
The PCB etching equipment market is expected to reach $2.58 billion by 2030, growing at a CAGR of 8.2 percent.
Unimicron continues to expand high-end substrate capacity, with its ABF utilization rate above 90%, and capacity allocation is being made to meet demand for GPUs and self-developed ASICs; Kinsus is also actively expanding ABF capacity, expecting monthly capacity to increase by about 25% by 2027, with further expansion plans extending to 2029; and Nan Electric Power is investing in new capacity for high-end substrates, targeting large-size, high-layer products.
The global electronic chemicals and materials market is projected to grow from $76B in 2025 to $109B by 2031, at a compound annual growth rate of 6.5 percent over the forecast period 2026–31.
Memory chip suppliers are under pressure as debate intensifies over whether Chinese competition is threatening memory incumbents and speculation about when the market could become oversupplied.
TJGC Group named Kalvin Kwok executive director of the component distributor.
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