Ventec is putting an idle factory back to work to expand its supply of advanced PCB materials. Google’s next test of AI hardware is headed beyond Earth.

Google plans to launch a prototype satellite on Oct. 1 to test whether its AI chips can run in orbit, an early step toward its proposed space-based computing system.

Vision Engineering released EVO cam AURA 4K digital microscope.

Flux released AI enclosure design capability.

Amada Weld Tech added motorized focusing and vertical or horizontal mounting options to its Sigma LS femtosecond laser micromachining subsystem.

PCEA announced 11 free technical sessions and a keynote for PCB West 2026, covering topics including AI, PCB design, signal integrity, flex, UHDI, fabrication and assembly on Sept. 30 in Santa Clara, CA.

PCB West 2026 will feature a panel examining AI, interposers, high-speed and high-current design, and optical interconnects shaping PCB design through the end of the decade.

PCEA announced two fall webinars covering the role of the PCB designer and signal routing for controlling energy, signal integrity and EMI in digital PCBs.

PCB West 2026 will feature 11 presentations on electronics assembly processes, including a half-day solder paste qualification workshop and sessions covering SMT printing, stencil design, reflow soldering and more.

PCEA will host a 3.5-hour webinar on Nov. 4 led by Susy Webb covering signal routing techniques to improve signal integrity and EMI performance.

CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Ventec approved a $47M investment to convert an idle Kunshan factory into a production hub for AI and HDI materials.

Zhen Ding priced an $800M overseas convertible bond offering

Qualcomm said Apple renewed its global patent licensing agreement, extending the companies’ intellectual property arrangement as Apple works to reduce its reliance on Qualcomm modem chips.

Dixon Technologies India Limited and Vivo Mobiles are establishing a joint venture focused on Android smartphone manufacturing in Greater Noida.

Taiwan’s PCB output is expected to top $1 trillion on AI boom.

Foxconn Technology Group plans to alter its Mount Pleasant facility and add up to 700 jobs to meet strong demand for artificial intelligence.

RBB has added a second manufacturing shift at its Wooster, OH, facility.

Bifrost Electronics, a developer and manufacturer of advanced electronic hardware for quantum computers, named Doug Campbell chief executive.

Heat Staking vs. Ultrasonic Welding for PCB Assemblies
PCD&F/CIRCUITS ASSEMBLY

Programmable Spinning of Integrated Circuit Fibres
Nature Electronics

Vision-Based PCB Defect Detection Using YOLOv5 and MobileNetV2 with Grad-CAM
Proceedings of International Conference on Computational Intelligence

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.