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November 29th, 2021
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

Technodinámika has developed a self-destructing flash memory that removes information with the push of a button included in one of the ends. In this new device, both the memory chip, the power and control elements are united in a housing. The built-in power supply activates the electrical detonator that burns the circuit board.

Xiaomi is the latest electronics manufacturer to break into automotive, with plans to build an automobile manufacturing plantin Beijing with an annual capacity of 300,000 vehicles.


ABF substrates will be among certain components that will see shortage widen in 2022, which may tighten supply of notebook processors affecting notebook shipments as a result, according to industry sources.

A*STAR and STMicroelectronics are launching an R&D collaboration in the field of silicon carbide for power-electronics applications in the automotive and industrial markets.

Printed circuit design engineers can benefit from the PCE-EDU Printed Circuit Engineering Professional curriculum, a new weeklong program on printed circuit engineering layout based on current technology trends.

CIRCUITS ASSEMBLY has reopened registration for its annual Service Excellence Awards (SEAs) for EMS providers and electronics assembly equipment, material, service, and software suppliers. The 2022 program returns to its original format after a focus group of past participants emphasized the value of the feedback they receive from their customers.

UC Riverside researchers have built technology that squeezes tungsten lamp light into a 6nm spot at the end of a silver nanowire. That lets scientists produce color imaging at an "unprecedented" level, rather than having to settle for molecular vibrations.

Samsung Electronics announced that five of its memory products achieved global recognition for successfully reducing its carbon emission, while 20 additional memory products received carbon footprint certification.

Getting Up to Speed
Even our wildest predictions for new technologies like the IIoT could be too modest.

Alun Morgan



TPCA said production value of Taiwan’s PCB makers is expected to expand about 18% year-on-year this year to exceed NT$800 billion (US$28.78 billion) for the first time, thanks to robust demand for substrates used in iPhones and vehicles.

Alco Holdings announced revenue from its proprietary brand computer products increased 49% year-on-year to HK$337 million in the six months ended Sept. 30 as its shifts from its model to OEM from ODM.

Tata is in talks with three Indian states to invest up to $300 million to set up a semiconductor assembly and test unit, two sources familiar with the matter said, as part of the conglomerate's push into high-tech manufacturing.

Jusda, a logistics arm of Foxconn Technology Group, is considering raising funds from private investors ahead of a potential IPO as early as next year, according to people familiar with the matter.

GaN Systems has formed a strategic partnership with ASE Technology’s subsidiary, Universal Scientific Industrial (USI), to co-develop GaN power modules for the EV market.

Foxconn started production on Friday at its new integrated circuit packaging and testing factory in Qingdao, China.

United Microelectronics and Micron Technology have settled a civil lawsuit in which the US memory chipmaker accused the Taiwanese company of stealing and leaking its intellectual property to a Chinese partner.

SKP Resources said net profits fell 9% for its second quarter ended Sept 30 as the electronics manufacturing services provider took a 24% hit in quarterly revenue.

Profits of China's major industrial firms maintained sound growth momentum in the first 10 months of the year as industrial production continued to recover and business operations continued improvements, official data showed Saturday.

TTM Technnologies named Paige Fiet process engineer.

Food-Processing Methodologies Offer Ideas to Chew On
Regardless of whether a project is outsourced, when these units are manufactured in a single location, the wastes of overproduction, waiting, transportation and inventory are likely to be significant. At the same time, dividing variable-demand, small-lot production among multiple facilities has the potential to create inventory imbalances and production inefficiencies, particularly if the work is divided among contract manufacturers and managed separately by region.

Jim Barnes



BGA Removal Using Focused IR

Depth Distribution of Defects in SiC PiN Diodes Formed Using Ion Implantation or Epitaxial Growth
Physica Status Solidi (b)

A Soft Magnetic Pixel Robot that Can be Programmed to Take Different Shapes


Dec. 7-9: Semicon West, San Francisco/Virtual
Dec. 8-10: HKPCA Show, Shenzhen
Jan. 10-14: PCE-EDU Printed Circuit Engineering Professional, Online, San Diego
Jan. 25-27: IPC Apex Expo 2022
Jan. 31-Feb. 3: Pan Pacific Microelectronics Symposium, Honolulu
Feb. 15-17: Wafer-Level Packaging Symposium, San Jose
Apr. 11-13: PCB East 2022, Marlborough, MA
June 6-9: Zuken Innovation World, San Antonio


Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.


             Sept. Trend
Semi equip. billings 35.5% Down
ICs 27.6% Down
PCBs 1.25 Down
Computers/elec. products 5.26 Flat

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

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