Electronic component sales sentiment is taking a hit, with ECIA reporting the steepest monthly decline in more than four years. Meanwhile, Ventec and MICAM are looking to strengthen Europe's PCB supply chain with plans to establish copper-clad laminate production in Ireland. 

PCEA has opened its call for abstracts for PCB West 2027, scheduled for September 14–17 in Santa Clara, CA, with submissions due January 8, 2027.

Cadence launches OrCAD Xplore design platform.

Siemens launches HyperLynx agentic toolkit.

New research shows how levelers enable defect-free copper filling in acid copper sulfate electroplating for interconnects.

Ford is recalling more than 11,000 vehicles over a circuit board issue that can cause an unexpected shift to neutral.

Nordson launches PICO pulse XP HV jetting system.

New research shows how levelers enable defect-free copper filling in acid copper sulfate electroplating for interconnects.

PCEA opened registration for PCB East 2027, featuring 120 hours of technical training, 28 new classes and a one-day exhibition in the Boston suburbs.

PCEA will host a free webinar Nov. 17 featuring Yash Sutariya discussing global PCB supply chain disruptions, sourcing risks and strategies for strengthening supply resilience.

PCEA will host a free webinar Dec. 8 featuring Asaf Israelit discussing how AI can optimize entire BoMs, identify component alternatives, reduce costs and address supply chain risks before production.

PCEA Training announced its winter and spring 2027 schedule for the Certified Professional Circuit Designer (CPCD) program, with online classes beginning Jan. 15 and Mar. 19 and an in-person session April 26–30 at PCB East.

CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

ECIA's October Industry Pulse survey showed electronic component sales sentiment for November falling 19.2 points month-over-month to 112.4, marking the steepest monthly decline in more than four years.

Foxconn posted record October revenue, up 45 percent year over year on AI demand.

Ventec and MICAM plan to establish copper-clad laminate production in Ireland.

Schmid Group received an order to supply wet-process equipment for a glass core substrate manufacturing facility in South Asia.

Doosan confirmed it will invest about $405M to expand CCL production in Changshu, China.

At Hon Hai Tech Day, Foxconn expanded its AI strategy into data center system integration, showing the Nvidia DSX POD containerized solution.

Vingroup says its VinFast car unit is in early talks with Foxconn about an EV partnership.

Humanoid robot maker Agility Robotics went public after about $201M in new funding led by Foxconn.

China’s tungsten export curbs are sending prices soaring for micro drill bits used on AI PCBs, with China holding nearly 80 percent of global output.

Itera named James Pentalow head of strategic programs.

GreenSource Fabrication promoted Megan Teta sales manager.

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.