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THE LEAD
The global PCB market reached $85B in 2025, fueled by growing demand for AI infrastructure and high-speed networking. Shindo Eng Lab has proposed a 3-D semiconductor packaging architecture that stacks high-bandwidth memory beneath the GPU.
TECH NEWS
PCEA Training announced its winter and spring 2027 schedule for the Certified Professional Circuit Designer (CPCD) program, with online classes beginning Jan. 15 and Mar. 19 and an in-person session April 26–30 at PCB East.
Siemens and Nvidia are jointly developing AI-driven factory automation that they say cuts PCB assembly effort by up to 85 percent.
Shindo Eng Lab has proposed a 3-D package that stacks HBM beneath the GPU, with power fed from the PCB through metal pillars to the interposer.
In the latest episode of PCB Chat, Qualcomm senior designer and manager Miroslava Velasco discusses her career in PCB design, the mentors who helped shape her professional development, and the importance of encouraging the next generation of women engineers.
Hirose announces FX36 series floating board-to-board connector.
MicroCare introduces FRC2 general purpose flux remover.
PCEA will host a 3.5-hour webinar on Nov. 4 led by Susy Webb covering signal routing techniques to improve signal integrity and EMI performance.
CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.
Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.
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MATERIAL GAINS
Software-Defined Warfare Meets the Hardware Supply Crunch
Establishing the technological upper hand has always taken priority for military forces. In today’s data-driven, AI-powered world, superiority comes from faster decision-making, seamless interoperability between systems, and real-time adaptability.
ALUN MORGAN

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