Samsung advanced its push toward agentic AI-driven manufacturing as China moves to increase advanced chip output fivefold.

Samsung plans to transition all global manufacturing sites to AI-driven factories by 2030, deploying agentic AI, digital twins and robotics across production.

The March digital issue of Circuits Assembly/PCD&F is now live, featuring coverage on high-thermal dielectrics, UHDI fundamentals, AI-driven packaging advancements, supply chain resilience strategies and more.

Are AI data centres in space closer to reality than we think? Industry leaders debate whether orbit could offer a cheaper, more scalable alternative to Earth-based infrastructure.

VPF launches 630900-1001-801 polyimide adhesive.

Stackpole announces TNC series thick film NTC thermistors.

Umicore launches Auruna 8000 gold-iron electrolyte plating acid.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a 14-company tabletop exhibition and networking events.

PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.

CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the March 31 deadline.

Registration is now open for PCB East 2026, the electronics industry’s East Coast conference and exhibition.

PCB East 2026’s exhibition hall is more than 95 percent sold out, reflecting strong exhibitor demand ahead of the April event in Worcester, Massachusetts.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Foxconn forecast stronger-than-usual first-quarter performance after January revenue rose 35.5 percent year over year.

China aims to increase advanced chip output fivefold to 100,000 wafers within one to two years, up from fewer than 20,000 currently.

Cal-Comp’s full-year revenue declined 5.6 percent to $3.9B, while net income fell 21.5 percent to $57M year over year.

India has opened its first semiconductor assembly and test facility, with Micron launching a Gujarat plant to package memory chips.

Fulltech Fiber Glass approved a $99M investment to build a new Thailand plant, targeting 2027 production.

Foxconn unveiled a 2026–2030 sustainability roadmap targeting 75 percent renewable energy use.

Europe is accelerating its push for digital sovereignty, tightening control over cloud services, AI platforms and semiconductor assets as trade tensions and security concerns drive new mandates.

Amtech Electrocircuits is implementing compliance measures and adjusting sourcing strategies following the Supreme Court’s ruling on IEEPA tariffs.

Inventec implemented Siemens Valor NPI and Process Preparation X.

Escatec appointed Christa Schnider chief sales officer.

Consider Manufacturing Complexity When PCB Designs Have Tight Hole-to-Trace Spacing
PCD&F/CIRCUITS ASSEMBLY

The 2025 AI Index: Documenting Sociotechnical Features of Deployed Agentic AI Systems
MIT

Flexible Electronics in Robotics Systems: From Devices to Applications
SmartBot

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.