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April 12th, 2025
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

Apple is seeking a tariff exemption amid escalating US-China trade tensions but is actively boosting India-based production and considering pricing strategies to avoid domestic iPhone sticker shock.

Conventional PCB manufacturing is wasteful, harmful to the environment and energy intensive, says IDTechEX, and can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.

TECH NEWS

Altera launched a virtual university program offering FPGA-focused courses, lab kits, and AI-aligned curricula, with discounted tools and remote lab access to support educators and students.

Vishay upgrades LTO series thick film power resistor.

Registrants for the PCB East exhibition this April will gain access to five free technical sessions (plus a keynote presentation) ranging from printed circuit design to fabrication and assembly.

Registration is open for CIRCUITS ASSEMBLY's annual Service Excellence Awards (SEAs) for EMS providers and electronics assembly equipment, material, service, and software suppliers.

PCB Detroit features the top experts on printed circuit board design, including Rick Hartley, Susy Webb, Dan Beeker, and Stephen Chavez, among others.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

PCEA Training is offering a five-day Certified Professional Circuit Designer (CPCD) training and certification class on May 9, 16, 23, 30, and June 6.

DESIGNER'S NOTEBOOK
Implementing Flash Memory in PCB Design
Flash memory routing can create EMI issues if rushed—careful layout and length matching are key. Designers are urged to factor in signal integrity early to avoid costly board respins.

JOHN BURKHERT, JR.

John Burkhert Jr.





















BUSINESS NEWS

Dixon, India's largest EMS provider, will set up a notebook and PC manufacturing facility in Tamil Nadu, making products for brands like HP.

Vanguard International Semiconductor will speed up construction of its 12-inch wafer fab in Singapore as geopolitical risks prompt customers to seek more options to make chips outside China.

Luxshare, which assists Apple with iPhone assembly and AirPods production, recently stated its is looking at Southeast Asia as its top choice for expansion.

Avalon Technologies has announced that its board of directors has approved a proposal for the EMS to invest in motor control OEM Zepco Technologies.

Daeduck Electronics made significant strides in the semiconductor industry by delivering multilayer PCB samples for AI accelerators to AMD.

BofA estimates iPhone costs could rise 90%, if fully made in the US, driven by labor and tariffs. Apple is expected to continue diversifying manufacturing, especially in India.

Firan Technology Group's Q1 revenue rose 23% to C$42.9M, with adjusted net earnings up 214% to C$3.3M.

US chipmakers which outsource manufacturingwill be exempt from China’s retaliatory tariffs on US imports, according to a notice by the main Chinese semiconductor association on Friday.

Cyient Group and Deutsche Aircraft expanded their strategic partnership.

A state-of-the-art Common Facility Centre (CFC) is being established in Naya Raipur, India, under the Greenfield Electronics Manufacturing Cluster initiative, marking a significant step in Chhattisgarh’s journey toward becoming a national hub for electronics and semiconductor manufacturing.

TFE named Brian Zirlin technical regional sales manager.

THE ROUTE
EIPC-PCEA Road Show Brings Experts to You
PCEA and EIPC will launch the "Design to Fabrication" symposium series in three Baltic cities next month, uniting global experts in design and manufacturing. PCEA also introduced a Discord server for members to connect, share technical insights and mentor others.

MIKE BUETOW

Mike Buetow






















TECHNICAL ARTICLES


Characterizing Etchback and Dielectric Loss Tangent
PCD&F/CIRCUITS ASSEMBLY



Three-Dimensional Transistors with Two-Dimensional Semiconductors for Future CMOS Scaling
Nature



Rippled Metamaterials with Scale-Dependent Tailorable Elasticity
Proceedings of the National Academy of Sciences

EVENTS

April 22-24: NEPCON China 2025Shanghai
April 23: PCEA San Diego Chapter MeetingDel Mar, CA
April 23-24: Del Mar Electronics ShowDel Mar, CA
April 24: SMTA Atlanta Expo & Tech ForumAtlanta
April 24: Zuken Tech TourSan Jose
April 24: PCEA Portland Chapter MeetingOnline
April 29-May 2: PCB EastBoxborough, MA
May 6-9: EIPC/PCEA Design to Fabrication Technical Symposium
Copenhagen, Stockholm and Tallinn
May 9-June 6: PCEA Training Certified Printed Circuit Designer CourseOnline
June 2-3: PCB DetroitDetroit, MI
June 5: Zuken Tech TourDearborn, MI


 

BOOK-TO-BILLS/MARKET TRENDS
             Feb. Trend
EMS 1.33 Up
ICs 17.1% Up
PCBs 1.33 Up
Component Sales Sentiment 113% Up
Changes are year-over-year.    

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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