Calumet Electronics has opened a $54M Michigan facility that it says is the first dedicated US operation for panel-level organic substrate manufacturing. Johns Hopkins researchers are developing a 3-D-printed heatsink using phase-change materials that could reduce thermal-management system size and weight by more than 50 percent. 

Johns Hopkins researchers are developing a 3-D-printed heatsink that uses phase-change materials to absorb intense heat while potentially reducing thermal-management system size and weight by more than 50 percent.

PCEA Training said only a handful of seats remain for its CPCD training and certification program, taking place Sept. 28-Oct. 2 at PCB West 2026.

Rohm releases BH65T41xxxF 650V EcoIGBTs electronic compressors.

MGI Digital Technology, through its subsidiary Altix, is expanding digital inkjet processes into electronics manufacturing.

An upcoming PCEA webinar will look at component availability, lifecycle risk, lead times and electronics supply chain challenges.

PCEA announced 11 free technical sessions and a keynote for PCB West 2026, covering topics including AI, PCB design, signal integrity, flex, UHDI, fabrication and assembly on Sept. 30 in Santa Clara, CA.

PCB West 2026 will feature a panel examining AI, interposers, high-speed and high-current design, and optical interconnects shaping PCB design through the end of the decade.

PCEA announced two fall webinars covering the role of the PCB designer and signal routing for controlling energy, signal integrity and EMI in digital PCBs.

PCB West 2026 will feature 11 presentations on electronics assembly processes, including a half-day solder paste qualification workshop and sessions covering SMT printing, stencil design, reflow soldering and more.

PCEA will host a 3.5-hour webinar on Nov. 4 led by Susy Webb covering signal routing techniques to improve signal integrity and EMI performance.

CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Calumet Electronics has opened its $54M chip substrate manufacturing facility in Michigan, establishing what it says is the first dedicated US panel-level organic substrate manufacturing operation.

Flex agreed to acquire EPC Power for $4B.

A China Labor Watch investigation alleges Foxconn workers producing the iPhone 17 in Zhengzhou faced excessive overtime, wage withholding and temporary-worker levels exceeding limits under Chinese labor law.

Electronics imports help drive the US trade deficit to a 16-month high in July, per the latest Commerce Department data.

Dixon Technologies is looking to expand into high-value product segments across aerospace, defense, automotive, medical and industrial sectors as it charts its next phase of growth, chief financial officer Saurabh Gupta said in his message to shareholders in the company’s FY26 annual report.

Avalon Technologies and Zollner have formed a joint venture to manufacture printed circuit board assemblies, box-build and system integration in India.

The Philippines launched a semiconductor and electronics industry roadmap targeting $110B in annual exports by 2030.

Broadcom and Toppan are establishing advanced substrate manufacturing capacity in Singapore.

The Charge of the Bucket Brigade
PCD&F/CIRCUITS ASSEMBLY

Spatiotemporal Mapping of Anisotropic Thermal Transport in Gan Thin Films Via Ultrafast X-ray Diffraction
Nature Communications

Interfacial Reactions of Sn-19Bi-19In Solder on OSP and ENIG Surface Finishes During Thermal Aging
Journal of Electronic Materials

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.