Global semiconductor sales jumped 62 percent in February to $89B on AI-driven demand, with Foxconn reporting strong electronics growth while cautioning on geopolitical uncertainty.

BLT and partners use 3D printing to enhance OPPO’s foldable hinge design, improving durability and reducing display creasing in next-generation devices.

A new report highlights growing investment in photonic AI processors, as companies develop light-based computing to improve performance and reduce data center energy demands.

Apple’s foldable iPhone faces engineering challenges during testing, raising the risk of delays to mass production and shipment timelines.

Advanced Chip and Circuit Materials releases Celeritas SF1600 laminate.

Göpel Electronic expands Scanflex II with CAN-FD/LIN interface test module.

PCB East 2026 exhibition floor is sold out, with more than 85 exhibitors and expanded participation including AMD, Cadence/EMA, Indium, Lattice and Parmi.

PCEA is offering free technical sessions and a keynote at PCB East 2026, covering AI, UHDI, simulation and PCB design best practices.

CIRCUITS ASSEMBLY announced the winners of the 2026 New Product Introduction (NPI) Awards, recognizing leading electronics assembly equipment, materials and software introduced over the past year.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.

CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the April 31 deadline.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Global semiconductor sales reached $88.8B in February, up 61.8 percent year-over-year and 7.6 percent month-over-month.

Foxconn reports first quarter revenue rose 30 percent to $66B, driven by AI demand, but warns of ongoing geopolitical risks.

Intel’s advanced packaging business, which operates within the Foundry chip-making arm of the company, is having a growth spurt.

A Chinese PCB manufacturer adapts to tariff-driven disruptions by diversifying production while maintaining core operations in China amid shifting global supply chains.

VS Industry reported a net loss of RM29.6M for the second quarter ended Jan. 31, down from its net profit of RM15.4M a year ago.

A bipartisan group of lawmakers last week introduced a bill in the US House of Representatives that would severely limit the sale of advanced semiconductor manufacturing equipment to China and a selection of other countries, closing what experts say are critical loopholes in America’s AI export controls.

Samsung is expected to post record quarterly profits driven by surging AI-driven memory chip demand, with operating profit projected to rise sharply year over year.

SEMCO is raising prices for APF substrate material, according to published reports.

Samsung Electronics and SoftBank sign an agreement to jointly develop next-generation communications technologies, including 6G and AI-driven radio access networks.

Nano Dimension agrees to sell its AME and Fabrica product lines for up to $12.5M.

Indium signs a long-term agreement to source recycled critical metals in the US.

Cape EMS Berhad reported second quarter net profit of RM7 million ($1.74M), up from a loss of RM49M the previous year.

OSI Systems secured a $40M multi-year contract to supply electronic subassemblies for medical device platforms.

Express Manufacturing adds dual-sided flying probe testing with the Takaya APT-1600FD-SL dual-sided flying probe tester.

Arch Systems named Nirav Jariwala sales engineering manager.

Kyzen promoted Debbie Carboni to business manager, Electronics.

Consider Manufacturing Complexity When PCB Designs Have Tight Hole-to-Trace Spacing
PCD&F/CIRCUITS ASSEMBLY

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Scientists Build Five-in-One “Super Molecule” for Next-Gen Electronics
SciTech Daily

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.