The US has lifted export restrictions on chip design software to China, permitting Siemens EDA, Synopsys and Cadence to resume sales and support.

Huawei Technologies must stand trial on sweeping US criminal charges after a federal judge rejected its bid to dismiss a 16-count indictment. The case alleges theft of trade secrets, racketeering, and violations of Iran and North Korea sanctions.

By 2030, the most advanced LLMs should be able to complete, with 50 percent reliability, a software-based task that takes humans a full month of 40-hour workweeks. And the LLMs would likely be able to do many of these tasks much more quickly than humans, taking only days, or even just hours.

Virginia Tech engineers have developed a self-healing, recyclable PCB using liquid metal and vitrimer.

PCEA announced that PCB East 2026 will be held at the DCU Center in Worcester, MA, with exhibits on April 29 and a technical conference from April 28 to May 1, reflecting the event’s growth and focus on providing a first-class venue for attendees.

Researchers have developed a two-step acid leaching and electrowinning process to recover nanoscale copper particles from discarded mobile phone PCBs.

PCD&F launched its annual salary survey for PCB designers and engineers to gather industry compensation data.

PCEA has announced the technical program for PCB West 2025, featuring over 125 hours of training and more than 50 sessions, including 30 classes new to the industry-leading tech conference.

Tim Kang of Hanwha Semitech Americas talks pick-and-place machine selection and optimization on the Reliability Matters podcast.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Taiwan's Ministry of Economic Affairs is investigating a potential 24 billion acquisition of Hsinchu-based Source Photonics by China’s DSBJ, citing national security concerns.

Foxconn has withdrawn over 300 Chinese engineers from its iPhone assembly sites in India, potentially delaying Apple’s production ramp-up for the iPhone 17.

Microsoft will lay off nearly 4 percent of its workforce, the latest attempt by the tech giant to rein in costs amid hefty investments in artificial intelligence infrastructure.

The advanced IC substrate market is projected to hit 31B by 2030, with momentum in glass core and embedded die tech.

ImageTek Manufacturing is expanding its electronics assembly operations to a second site in North Springfield, VT,

Walton Digi-Tech has begun monthly exports of Bangladeshi-made PCBs to Greece.

GomSpace has partnered with Danish electronics firm NECAS to expand production capacity and increase delivery of satellite subsystems amid rising global demand.

Scanfil and Etteplan have expanded their strategic partnership with a service agreement to co-develop the Odin test platform and offer joint production testing solutions.

Frank Elektronik invested in an SMT line from ASYS.

Alicante-based TAIA has signed a commercial agreement with CERN to supply electronic circuits, including embedded component designs.

NOTE has secured a 12.3M order from a long-term Security & Defence customer, with production beginning in October.

Ryder Industries is quadrupling its Vietnam production capacity with a second facility.

Sierra Space named Drew Delaney director of OEM marketing.

Isola has transitioned from OTC Pink Sheets to the OTCID market.

Garmin promoted Laura Beth Yates to senior manager, PCB design.

When Do You Need Nitrogen in Reflow?
PCD&F/CIRCUITS ASSEMBLY

Non-Line-of-Sight 3D Object Reconstruction via mmWave Surface Normal Estimation
Massachusetts Institute of Technology

Liquid Metal-Vitrimer Conductive Composite for Recyclable and Resilient Electronics
Advanced Materials

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.