As AI data centers consume growing volumes of memory chips, manufacturers across multiple industries are urging the US government to address tightening supply and soaring prices. Chinese companies shipped nearly all humanoid robots during the first half of 2026.

PCEA will host a 3.5-hour webinar on Nov. 4 led by Susy Webb covering signal routing techniques to improve signal integrity and EMI performance.

MIT researchers found that microscopic wrinkles in chip materials can reduce local thermal conductivity by up to fivefold, creating heat hotspots that could limit the performance and reliability of advanced electronic devices.

PCEA released the sixth edition of PCB Basics: An Introduction to the PCB Industry, adding chapters on HDI/UHDI and AI applications across PCB design, fabrication, assembly, test, inspection and procurement.

Polar Instruments updates Speedstack with Ventec glass-free materials.

Yamaichi adds right-angled PCB socket to Y-Circ P T-Series.

Qingdao University and Liaocheng University researchers have presented a breakthrough ionic skin that seamlessly integrates three traditionally conflicting functionalities into a single, elegantly simple architecture.

PCB West’s early bird conference rate ends Aug. 21, with more than 50 classes and 120 hours of PCB design and assembly training scheduled for Sept. 29-Oct. 2 in Santa Clara.

CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.

Sean Patterson discusses why AI adoption in manufacturing depends on building practical workplace habits rather than relying on training alone in the latest PCB Chat.

PCEA has opened PCB East 2027 booth sales for returning exhibitors and Gold and Platinum corporate members. The exhibition will be held April 28, 2027, at the DCU Center in Worcester, MA, alongside the four-day technical conference, with general booth sales opening Aug. 12.

PCB West 2026 is nearly sold out, with fewer than 5 percent of exhibition booths remaining for the Sept. 29–Oct. 2 event at the Santa Clara Convention Center.

PCEA announced a dedicated electronics assembly program for PCB West 2026, featuring 10 technical sessions on solder paste, placement, reflow, stencil design and cleaning.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

AI-driven demand for memory chips is fueling a new wave of lobbying in Washington as electronics, automotive and medical device companies seek government action to ease shortages and rising prices.

Foxconn said it was building the world's largest production facility for US hardware leader Nvidia's GB200 "superchips" powering artificial intelligence servers.

Pegatron reported July consolidated revenue of NT$86B (approximately $2.7B), up 12 percent year-over-year.

Global humanoid robot shipments rose 272 percent year-over-year in the first half of 2026, with Chinese manufacturers accounting for 97 percent of shipments.

Apple is reportedly reducing its 2026 hardware production plans as AI-driven memory shortages tighten component supplies, potentially affecting availability of future iPhone, Mac and iPad models.

Taiwan’s substrate and printed circuit board makers reported strong July sales as demand for AI servers and high-performance computing continued to grow.

Ducommun reported its Electronic Systems segment net revenue for the quarter ended July 4 was $131M, up from 2025.

Sanmina-SCI India has been approved to establish a manufacturing unit in Oragadam, Sriperumbudur, expected to generate 1,350 jobs.

Anthropic is building an in-house chip design team to develop custom AI processors, complementing its use of hardware from AWS, Google, Nvidia and AMD.

Zero Defects International more than doubled its flying-probe ICT testing capacity with new equipment.

Amtech Systems named Guy Schecter president and CEO.

AIM Solder appointed Bruce Gao sales manager for South China.

AIM Solder appointed Jake Vlacich as senior product manager.

Selective UHDI: Using Ultra HDI Where Needed, Not Everywhere
PCD&F/CIRCUITS ASSEMBLY

Reliability Analysis and Parameter Optimization of Board-Level BGA Packaging Structures under Thermal-Drop Impact LoadC
Soldering & Surface Mount Technology

From Biotechnological Residues to Biodegradable Printed Circuit Boards: Aspergillus Niger Mycelium as a Structural Support Material
Cleaner Materials

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.