Pegatron said its first US factory in Texas is on track for completion by the end of March, with trial production of AI server products expected to begin soon after, as semiconductor industry leaders warn that an AI-driven global memory chip shortage could continue through 2027.

Registration is now open for PCB East 2026, the electronics industry’s East Coast conference and exhibition.

China has unveiled flexible fiber-based chip architectures as a potential alternative to conventional silicon.

Cadence is closing its call for presentations for CadenceLIVE Silicon Valley 2026.

As Moore’s Law reaches its physical limits, future computing gains are increasingly expected to come from chip specialization.

JarnisTech qualified a hybrid PCB lamination process that integrates high-frequency materials with FR-4, enabling 5G hardware makers to cut bare-board BOM costs by roughly 30–40 percent.

AllSpice.io releases DRCY AI design review agent.

Aven introduces MicroVue 2.0 digital microscope.

PCB East 2026’s exhibition hall is more than 95 percent sold out, reflecting strong exhibitor demand ahead of the April event in Worcester, Massachusetts.

Wally Rhines reviews the latest ECAD market data, including sustained year-over-year growth, regional sales shifts and employment trends across design and semiconductor tools on the PCB Chat podcast.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Pegatron said its first US factory in Texas is on track for completion by the end of March, with trial production of AI server products expected to begin in late March or April.

India is now pushing into chip assembly and testing to reduce supply-chain risk, with strong design talent already in place.

A global memory chip shortage driven by AI data center demand is expected to persist through 2027.

Aegis Software completed its acquisition of Simio, expanding its manufacturing operations platform with digital twin simulation and advanced planning capabilities.

Samsung has reportedly cleared all verification stages for its HBM4 memory, positioning the company as an early supplier for NVIDIA’s Vera Rubin AI platform with initial integration expected in mid-2026.

Cornelius Electronics will invest about $5.4M to expand production at Moldova’s Edineț Industrial Park, adding three new manufacturing halls.

Sanmina reported 59 percent year-over-year fourth quarter sales growth to $3.19B, while issuing first quarter revenue guidance below expectations despite higher earnings outlook.

Note reported fourth quarter sales down about 2 percent year-on-year to roughly $95M.

Semi-Kinetics opened a manufacturing facility in Nampa, Idaho and is hiring across SMT, assembly, materials and quality roles.

Boardera and Revco formed a partnership to automate PCB costing and quoting.

Connexion Technologies partnered with OMR Italia to expand its European PCB supply network.

Siemens promoted Sarmad Khemmoro to senior director of product strategy for Electronics & Semiconductor.

Anduril named Steve Mueller printed circuit board designer.

Microboard promoted David Kleffman to vice president, Engineering Solutions & Technology.

Building Relationships with AI Technology
PCD&F/CIRCUITS ASSEMBLY

AI-Enhanced Sorting Enabling Direct, High-Purity Urban Mining of Tantalum: A Novel Pathway from E-Waste to Critical Materials
Resources, Conservation & Recycling

Quad-Band Metamaterial Absorber with High Shielding Effectiveness Using Bold X-Shaped Ring Resonator
Journal of Electronic Materials

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.