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April 28th, 2026
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

PCB East 2026 kicks off today in Worcester, bringing engineers together for 80+ hours of training, new AI and UHDI sessions, and the debut of FPGA Horizons East. Ventec is exploring a US manufacturing facility to localize laminate and prepreg production.

TECH NEWS

The PCB East exhibition opens today in Worcester, featuring 85+ exhibitors, one day of show-floor access and several free conference sessions.

Researchers introduced a Mamba-based multi-cognitive model that improves PCB defect detection accuracy while reducing computational load.

Researchers demonstrated a wafer-scale dry-transfer method for MoS₂, enabling high-performance flexible electronics without contamination from traditional processes.

Nemanja Jokanovic discusses automating BoM management, outlining sourcing challenges and how AI-driven tools optimize analysis and supply chain decisions in the PCB Chat podcast.

Tomachie releases automated PCB schematic review service with generative DfT.

Koki expands BIG series low-Ag solder paste portfolio.

Koki expands 72M series low-Ag wire solder portfolio.

Nemanja Jokanovic discusses automating BoM management, outlining sourcing challenges and how AI-driven tools optimize analysis and supply chain decisions in the PCB Chat podcast.

PCEA and the SMTA Capital Chapter are sponsoring a webinar, “Design for Sourcing,” presented by supply chain expert Ed Dodd of Cofactr, starting at 1 p.m. EDT on May 5.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

Registration for CIRCUITS ASSEMBLY 2026 Service Excellence Awards for EMS providers and suppliers ends on April 30.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

ROI
Back to the 1970s? Lessons for Growth in Today’s Volatile Supply Environment
Over the past year or so, the world appears to be an episode of Back to the Future, with events eerily reminiscent of when I commenced my career in the 1970s.

PETER BIGELOW

Peter Bigelow





















BUSINESS NEWS

Ventec is evaluating a US manufacturing site to produce laminate and prepreg materials.

TSMC plans to open an advanced chip packaging facility in Arizona by 2029, adding CoWoS and 3-D-IC capabilities.

A new study found semiconductor firms with revenue surpassing 50 trillion won and net profit surging nearly 400 percent on strong AI-driven demand.

Thailand is advancing into higher-end PCB manufacturing, but 46 percent of producers still source under 20 percent of materials locally, highlighting ongoing supply chain gaps.

Celestica reported first-quarter revenue of $4B and net profit of $212M, up from $2.6B and $86M year over year.

Iranian-linked strikes are disrupting resin supply, driving PCB prices up 40 percent in April and extending lead times to 15 weeks.

Cadence reported first-quarter revenue of $1.4B and raised its 2026 outlook to up to $6.2B.

Sanmina reported second-quarter revenue of $4B.

Schmid reported first-quarter revenue of $19.5M and order intake of $14.6M while reaffirming its 2026 outlook.

AdvancedPCB installed a Creative Electron TruView Novus x-ray system.

Interconnect Cable Technologies installs Para Tech Coating KR850L system, adding in-house parylene coating.

ubersmt adds Promation PCB handling equipment.

Javad EMS adds ESPEC temperature chamber.

THE ROUTE
Another Mil Spec Bites the Dust
Defense Department specifications (aka mil specs), once the foundation (and bane, depending on whom you asked) of electronics design and production, continue to fade away.

MIKE BUETOW

Mike Buetow






















TECHNICAL ARTICLES

Reflow AI – Before There was Artificial Intelligence
PCD&F/CIRCUITS ASSEMBLY


Sustainable Polyurethane-based Dielectric Composites from Industrial and E-waste for High-Voltage Insulation Applications
Scientific Report


Three-dimensional Printing of Nanomaterials-based Electronics with a Metamaterial-inspired Near-field Electromagnetic Structure
Science Advances


EVENTS

Apr. 28-May 1: PCB East 2026Worcester, MA
May 15, 22, 29, June 5, 12: Certified Printed Circuit Design Training, Online
May 26-29: IEEE Electronic Components and Technology ConferenceOrlando
June 2-4: Fac Tec China 2026Shanghai
June 9-10: EIPC Summer Conference, Lithuania
June 9-11: ZIW Americas 2026Dallas
June 15-16: PCB Detroit 2026Detroit
June 24-26: Vietnam Intcomm 2026 & Electronic Vietnam 2026Ho Chi Minh City, Vietnam
Sept. 29-Oct. 2: PCB West 2026Santa Clara
Feb. 17-19, 2027: Nepcon JapanTokyo


 

BOOK-TO-BILLS/MARKET TRENDS
             Feb. Trend
EMS 1.32 Up
Semiconductors         62% Up
PCBs 1.08 Down
Component Sales Sentiment 139.7 Up
Changes are year-over-year.    

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ABOUT

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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