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March 21st, 2026
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

Researchers have developed a noncontact method to monitor active semiconductor devices in real time, while air freight disruptions tied to Middle East conflict are delaying chip shipments to Europe and tightening supply.

TECH NEWS

An always-on computer vision system developed by Nvidia researchers can detect human faces in less than a millisecond.

Researchers have developed a terahertz-based technique to monitor active semiconductor devices in real time without physical contact or disruption.

NSF funding is supporting new ion mobility instruments using PCB-based platforms to enable controlled chemistry and advanced molecular analysis.

Count On Tools introduces Mydata Midas 2026-5652 for component placement.

CIRCUITS ASSEMBLY announced the winners of the 2026 New Product Introduction (NPI) Awards, recognizing leading electronics assembly equipment, materials and software introduced over the past year.

Early bird registration for the PCB East 2026 technical conference ends March 27, ahead of the April 28–May 1 event in Worcester, MA.

Mike Buetow discusses Cadence’s acquisition of EMA Design Automation and what the deal could mean for the companies and the PCB design software market on the PCB Chat podcast.

Francisco Aguilar, CEO of Bounce Imaging, will keynote PCB East 2026, sharing how a prototype 360-degree tactical camera evolved into a mission-critical tool through iterative design and EMS collaboration.

PCB Detroit will return to Wayne State University June 15-16 with technical sessions covering ESD, EMI, RF design, thin copper impacts, thermal management, signal integrity and AI-driven PCB workflows, alongside a tabletop exhibition and networking events.

PCEA will debut the PCB Management Forum at PCB East on April 28, focusing on AI adoption, material shortages and workforce challenges.

CIRCUITS ASSEMBLY has opened registration for the 2026 Service Excellence Awards, inviting EMS providers and industry suppliers to benchmark customer service performance through direct customer feedback ahead of the April 31 deadline.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

FOREFRONT
AI Data Center Packaging Challenges Highlighted at Nepcon Japan
With more than 92,000 visitors and 1,850 exhibitors, Nepcon Japan celebrated its 40th anniversary in Tokyo in late January. Exhibit areas included IC and sensor packaging, power devices and modules, test, electronic component and materials, and more.

E. JAN VARDAMAN

E. Jan Vardaman





















BUSINESS NEWS

Jabil posted second quarter net revenue of $8.3B and raised its outlook for fiscal 2026.

Analog Devices announced the opening of its new advanced manufacturing facility in Thailand.

Indian EMS Zetwerk is preparing to confidentially file draft papers for an initial public offering within the next one to two weeks, aiming to raise up to $550M at a valuation of about $4B, according to published reports.

Taiwanese PCB companies such as Pengding Holdings (Avary), Wus and Shenghong Technology (Victory Giant) have announced large-scale expansion plans with investments exceeding $5.8B.

Foxconn is among potential bidders for the Singaporean semiconductor assembly and testing business UTAC Holdings in a deal that could value the company at about $3 billion, two people with knowledge of the matter said.

Note is acquiring STI Enterprises Holdings Limited for about $92M to expand capabilities.

Middle East air freight disruptions are delaying semiconductor shipments to Europe and tightening chip supply flows.

Allied Circuit (ACCL), a PCB manufacturer backed by Compal, reported that its new capacity added in 2025 has fully come online.

Is AI-driven demand for memory chips tightening global RAM supply and pushing consumer electronics prices higher?

Qnity is partnering with Nvidia to accelerate AI-driven materials research for next-generation semiconductors and advanced electronics.

Circuit Fabology Microelectronics Equipment, said to be the world’s largest maker of direct imaging equipment for PCB fabrication, is considering a public offering on the Hong Kong Exchange.

KLA has signed a memorandum of understanding with the Tamil Nadu government to invest $400M in setting up a global Research & Development and Innovation Campus in Chennai.

Sino ICT expects to return to profitability, driven by growth in its SMT and semiconductor equipment business.

AdvancedPCB has added a CIMS Phoenix MDI AOI at its fabrication plant in Arizona.

The Test Connection has added a Creative Electron 3-D x-ray and CT inspection system.

DESIGNER'S NOTEBOOK
Splitting a PCB for Concurrent Design
Printed circuit board design grows in complexity with each passing year. Many protocols must be implemented. An ASIC may be the center of attention, but there will likely be a memory bus along with other architectures, such as ethernet or USB, to move data around.

JOHN BURKHERT, JR.

John Burkhert, Jr.






















TECHNICAL ARTICLES

Consider Manufacturing Complexity When PCB Designs Have Tight Hole-to-Trace Spacing
PCD&F/CIRCUITS ASSEMBLY


The 2025 AI Index: Documenting Sociotechnical Features of Deployed Agentic AI Systems
MIT


Flexible Electronics in Robotics Systems: From Devices to Applications
SmartBot


EVENTS

Apr. 22-23: Del Mar Electronics ShowSan Diego, CA
Apr. 28-May 1: PCB East 2026Worcester, MA
May 15, 22, 29, June 5, 12: Certified Printed Circuit Design Training, Online
May 26-29: IEEE Electronic Components and Technology ConferenceOrlando, FL
June 2-4: Fac Tec China 2026Shanghai, China
June 9-10: EIPC Summer Conference, Lithuania
June 9-11: ZIW Americas 2026Dallas, TX
June 15-16: PCB Detroit 2026Detroit, MI
June 24-26: Vietnam Intcomm 2026 & Electronic Vietnam 2026Ho Chi Minh City, Vietnam
Sept. 29-Oct. 2: PCB West 2026Santa Clara, CA
Feb. 17-19, 2027: Nepcon JapanTokyo, Japan


 

BOOK-TO-BILLS/MARKET TRENDS
             Dec. Trend
EMS 1.24 Up
Semiconductors         25.6% Up
PCBs 1.18 Up
Component Sales Sentiment 120.1 Down
Changes are year-over-year.    

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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