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December 12th, 2025
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

AI-generated PCB design entered a new phase as Quilter completed a first-pass system layout using its physics-driven tools, coinciding with the US decision to permit conditional exports of Nvidia’s H200 chips to approved customers in China.

TECH NEWS

President Donald Trump on Thursday signed an executive order on artificial intelligence that will attempt to preempt a growing number of state laws governing the technology with a national standard.

Quilter announced the creation of the printed circuit board design for a computer using artificial intelligence tools in under a week.

PCEA reports that PCB East 2026 exhibition space is more than 70% booked and on track to sell out, with the event moving to the DCU Center in Worcester for its April 28–May 1 conference and April 29 exhibition.

Entries for Circuits Assembly's 2026 NPI Awards, recognizing innovations in electronics assembly equipment, material and software, are due Dec. 19.

Indium Corp. launches SiPaste C312HF halogen-free solder paste for printing fine features.

Stadler reports rising demand for domestic e-scrap processing as nations tighten cross-border waste rules.

APE debuts Intruder BGA workstation.

PCB West 2026 booth sales are now open to all exhibitors, with more than 60 percent of the floor already reserved following early access for returning companies.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

TopLine Corp. offers zero ohm jumpers and dummy components.

MATERIAL GAINS
China’s Solar Capacity Surges as Grid Challenges Push New Energy Strategies
While climate change is obviously the big-picture issue in the global drive to decarbonize, energy security is an important aspect that is shaping governments’ policies worldwide.

ALUN MORGAN

Alun Morgan





















BUSINESS NEWS

Taiwan’s sales of rigid printed circuit boards rose 16 percent year-over-year in November.

President Donald Trump said the USwill permit Nvidia to ship H200 AI chips to approved customers in China under new conditions aimed at preserving national security.

Scanfil closed its acquisition of Adco Circuits, adding a US aerospace and defense manufacturing base.

The US Pentagon has launched a $1B program to build industrial base for attack drones.

Worldwide foldable smartphone shipments are forecast to grow 10 percent year-on-year in 2025 to 20.6M units, IDC said.

US export-control proposals, including the GAIN AI Act, raise fresh uncertainty for data center operators abroad as access to high-performance AI chips becomes increasingly restricted and subject to stricter compliance checks.

AI demand is lifting Taiwan’s IC distributors to record levels.

China’s $47B Big Fund III and the US STRIDE Act together signal a tightening split in semiconductor supply chains, creating new long-term constraints for equipment sourcing and cross-border manufacturing.

Worldwide server market revenue reached a record $112B during the third quarter, a year-over-year increase of 61 percent in vendor revenue.

South Korea is weighing a $3.1B state-and-industry-backed legacy foundry project aimed at strengthening domestic chip sector as global semiconductor competition intensifies.

Indian electronics manufacturers are urging the government to permit China-linked joint ventures under an automatic approval route capped at 26 percent ownership.

Compal Electronics is moving to expand its North American manufacturing footprint with proposed facilities in Taylor and Georgetown, TX.

DESIGNER'S NOTEBOOK
Interconnect Technology for Chiplets
In August, the Universal Chiplet Interconnect Express standard revision 3 was issued. This follows revision 2 by exactly a year. The first selling point of revision 3 is higher data rates, double that of the previous version.

JOHN BURKHERT, JR.

John Burkhert, Jr.






















TECHNICAL ARTICLES

Beyond the Gerbers: How Unstructured Data Drives PCB Cost and Lead Time
PCD&F/CIRCUITS ASSEMBLY


Graph Neural Networks for Automatic Addition of Optimizing Components in Printed Circuit Board Schematics
ECML PKDD 2025/Lecture Notes in Computer Science


Circular Innovation: How to Build Reverse Electronics Supply Chains – the Case of CIRC-UITS Project
IFIP Advances in Information and Communication Technology


EVENTS

Jan. 21-23: 40th Internepcon JapanTokyo Big Sight, Japan
Feb. 2-5: Pan Pacific Strategic Electronics SymposiumHawaii
Feb. 3-4: EIPC Winter ConferenceAix-en-Provence/Marseille, France
Feb. 6, 13, 20, 27, Mar. 6: Certified Printed Circuit Design Training, Online
Feb. 17-19: Chiplet SummitSanta Clara, CA
Apr. 22-23: Del Mar Electronics ShowSan Diego, CA
Apr. 28-May 1: PCB East 2026Worcester, MA
May 26-29: IEEE Electronic Components and Technology ConferenceOrlando, FL
June 9-11: ZIW Americas 2026Dallas, TX
June 15-16: PCB Detroit 2026Detroit, MI
June 24-26: Vietnam Intcomm 2026 & Electronic Vietnam 2026Ho Chi Minh City, Vietnam
Sept. 29-Oct. 2: PCB West 2026Santa Clara, CA


 

BOOK-TO-BILLS/MARKET TRENDS
             Oct. Trend
EMS 1.26 Down
Semiconductors         15.3% Up
PCBs 1.00 Up
Component Sales Sentiment 122.2 Up
Changes are year-over-year.    

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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