Registration is now open for PCEA’s 2025 New Product Introduction (NPI) Awards for electronics assembly equipment, materials and software suppliers.

A US congressional commission has proposed a Manhattan Project-style initiative to fund the development of AI systems that will be as smart or smarter than humans amid intensifying competition with China over advanced technologies.

A research team at the Technical University of Dresden, Germany, has succeeded in developing fully biodegradable printed circuit boards using an approach known as "Leaftronics."

Graphene has lived up to its promise in the lab. Now, EU researchers are working on supporting its wider adoption in high-end electronics, photonics and sensors.

City University of Hong Kong researchers have developed a method and tool for recovering metals from waste printed circuit boards (PCBs) by electrodeposition.

Keysight released EDA 2025 software suite.

Nano Dimension launched Exa 250vx DLP 3-D printer.

Purdue University was named the lead academic Semiconductor Manufacturing and Advanced Research with Twins (SMART) USA Digital Twin Center and also will chair the consortium’s Strategic Governing Council.

PCEA has announced its winter schedule for the Certified Printed Circuit Engineer program.

Foxconn will build new physical robotics factories in the US, Mexico and Taiwan to meet the demand for Nvidia's new Blackwell chips.

India’s burgeoning electronics manufacturing industry faces a pressing deficit of 10 million trained professionals, while the sector’s 25-30% compounded growth rate is expected to generate 12 million jobs by 2027-28.

Electronics exports in India reached the highest-ever mark of $19.1 billion for the first seven months of the financial year.

Malaysian electronics exports in October grew 7.6% year-over-year while accounting for more than 41% of total exports.

Foxconn has reportedly ordered the hiring agents that help recruit iPhone assembly workers in India to remove age, gender and marital criteria as well as the manufacturer's name in job advertisements.

Physik Instrumente, a developer of high-precision positioning technology and piezo applications, has expanded its electronics manufacturing site in Rosenheim, Germany.

NetVia Group announced an investment in Frontline InCAM Pro software to boost its capabilities in precision PCB manufacturing.

RBB entered a strategic partnership with LogiSync to enhance its in-house design capabilities.

ECD has increased production capacity by 100% to accommodate significant order growth for its SmartDRY Intelligent Dry Storage portfolio.

Austin American Technology installed a HydroJet cleaning system at its Guadalajara, Mexico, facility and secured a new project in Juarez.

BAE Systems will develop advanced electronic warfare countermeasures to protect US Army combat vehicles.

Gen3 will distribute RAS’ HATS² (Highly Accelerated Thermal Shock) test system globally.

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PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.