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May 10th, 2024
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

The US will triple its domestic semiconductor manufacturing capacity from 2022 – when the Chips Act was enacted – by 2032, the Semiconductor Industry Association projects in a new report.

PCB East 2024 will feature experts in printed circuit design and manufacturing on hand to answer attendee questions during the exhibition on June 5.

TECH NEWS

Tips for optimizing an internal power source combined with an external option.

Optera launched Outreach module for Supply Chain Manager.

PCD&F opened its annual salary survey of printed circuit board designers, design engineers and other layout specialists.

Zestron will host a webinar, Advancements in Solder Paste Printing: Cleaning Compatibility of Jettable and Screen-Printable Solder Pastes in Advanced Electronic Assemblies, on May 16.

Winning the battle against corrupt semiconductors.

PCEA Training announced the deadline to register for the next Certified Professional Circuit Designer class is June 4.

MATERIAL GAINS
Learning from the Past
New Chinese restrictions on the technology, including processors, permitted in equipment procured by government agencies are the latest move in the global battle for influence in the semiconductor industry; itself a part of a larger struggle for economic power.

ALUN MORGAN

Alun Morgan





















BUSINESS NEWS

MKS Instruments announced $868 million in first quarter revenue, up 9.3% from 2023's first quarter.

Ducommun reported first quarter revenue of $190.8 million, an increase of 5.3% over the first quarter of 2023.

Incap saw revenue of EUR51.4 million ($55.2 million) in the first quarter, a 29.3% year-over-year decline.

Hongxin Electronics Technology Group has announced a CNY1.5 billion ($207.6 million) deal to provide AI computing servers to China's Qianyang government in northwestern Gansu province.

Smartphone and PC shipments will each show growth of around 2% this year, driving small unit shipment growth in all package categories, TechSearch International forecasts in a new report.

TSMC’s advanced packaging capacity is fully booked until 2025 due to hyper demand for large, powerful chips from cloud service giants like Amazon AWS, Microsoft, Google, and Meta.

SK Hynix has agreed to sell its nearly 50% stake in its foundry unit based in China to a Chinese state-owned enterprise.

The Indian government is looking to develop policies that will encourage electronics manufacturers, including Apple, to expand their design activities within the country.

Wistron’s April revenue was a record high for the same period in previous years.

SMIC, China's largest contract chipmaker, reported a first quarter revenue rise of 19.7% on Thursday, as its global customers rebuilt their inventories.

The US Department of Commerce has revoked several export licenses that allowed some companies to supply goods, including semiconductors, to Chinese electronics manufacturer Huawei.

Dixon Electronics announced a partnership with Nokia Solutions and Network OY to develop and manufacture telecom products for Nokia.

Bright Machines is partnering with Microsoft Azure to build and distribute electronics manufacturing software.

NEOTech installed Palomar 8100 wire bonder machines at its Chatsworth, CA, facility.

Coherix has partnered with Eastern Michigan University to develop a “factory-of-the-future” manufacturing and assembly technology program.

Plexus will produce and ship Simbe’s retail robotics-as-a-service.

Inovaxe appointed Jorge Gonzalez Mexico regional sales manager.

Curtiss-Wright named Justin Fleming electrical engineer.

FOCUS ON BUSINESS
Follow the Money
What are you doing differently this year?
Is your topline growing? Is your slow-moving inventory number shrinking? Are you attracting new clients while defending good existing ones? Is your cash position improving? Or are you stuck in an EMS/OEM mud pit?

JAKE KULP

Jake Kulp






















TECHNICAL ARTICLES


How the PCB Stackup Helps Control EMI
PCD&F/CIRCUITS ASSEMBLY



Efficient and Selective Gold Recovery Using Amine-Laden Polymeric Fibers Synthesized by a Steric Hindrance Strategy
Chemical Engineering Journal



Efficient and Selective Gold Recovery Using Amine-Laden Polymeric Fibers Synthesized by a Steric Hindrance Strategy
Journal of Electronic Materials

EVENTS

May 14-16: Electronics in Harsh Environments ConferenceCopenhagen, Denmark
May 28-29: New-Tech Exhibition 2024Tel Aviv, Israel
May 28-30: Semicon Southeast Asia 2024Kuala Lumpur, Malaysia
May 28-31: Electronic Components and Technology ConferenceDenver, CO
June 4-7: PCB East 2024Boxborough, MA
June 10-12: PCBAA Annual ConferenceWashington DC
June 14: Printed Circuit Engineering Professional (CPCD) ClassOnline
June 18-20: 2024 SMCBA Conference & ElectroneX ExpoSydney, Australia
Oct. 8-11: PCB West 2024Santa Clara, CA
Oct. 30: NW Electronics Design & Manufacturing ExpoHillsboro, OR
Nov. 13: PCB CarolinaRaleigh, NC


SUBMISSIONS

Email industry press releases or links to the editors of PCD&F/CIRCUITS ASSEMBLY: pr@pcea.net.

 

BOOK-TO-BILLS/MARKET TRENDS
             March Trend
EMS 1.31 Up
ICs - Up
PCBs 1.13 Up
Component Sales Sentiment 106.9% Up
Changes are year-over-year.    
ABOUT

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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