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November 1st, 2024
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

Siemens will acquire Altair Engineering in a deal worth approximately $10 billion.

Apple is reportedly conducting initial production testing of its new iPhones in India, moving away from China for the first time.

TECH NEWS

A team from Sichuan University has developed a method for producing high-performance polymer composites containing liquid metal – significantly improving the polymers’ thermal conductivity.

Need an extra ADC? This design idea adds one for only a few extra cents and takes up negligible space on a PCB.

Würth rolled out gold-plated FPC connector.

Kyocera AVX released dual-entry card-edge connectors.

A new quantum device might help discover new, complex materials that can be used to design high-performance electronics.

ROUGHLY SPEAKING
Fabricator Formats
Software updates and engineering process changes are hidden roadblocks for industry adoption of modern data exchange formats like Gerber X3, ODB++ and IPC-2581. Akin to the iceberg lurking under the surface, significant issues are holding back the industry from wider adoption.

GEOFFREY HAZELETT

Geoffrey Hazelett





















BUSINESS NEWS

Flex reported sales of $6.5 billion for the second quarter of its fiscal year, down 5.6% from the same quarter of 2023.

TTM Technologies announced $616.5 million in sales for the third quarter, up 7.7% from 2023's third quarter.

ITW's Test & Measurement and Electronics segment saw revenue of $697 million for the third quarter, down 0.2% from 2023's third quarter.

Benchmark Electronic's third quarter revenue of $658 million represented a decline of 8.6% from the same quarter in 2023.

Syrma SGS Technology is targeting $1 billion in revenue by 2027 and is evaluating manufacturing opportunities for semiconductors and PCBs, according to a company official.

Kaynes Technology India announced revenue of INR5.72 billion ($67.8 million) for its second fiscal quarter, up 59% year-over-year.

Asteelflash opened a $19 million production facility near Wrocław, Poland, enhancing its box-build and high-level assembly capabilities in the automotive and industrial sectors.

China’s manufacturing output expanded in October for the first time since April, rare good news for leaders struggling to boost activity in the world’s second-largest activity.

Legrand UK & Ireland has announced the opening of a new electronics manufacturing hub in Northumberland, UK next year.

Samsung Electronics reported third quarter high-bandwidth memory (HBM) chip sales rose more than 70% from the previous quarter, with the fifth-generation HBM3E chips expected to contribute 50% of total HBM sales in the fourth quarter.

Schmid Group opened a new Asia-Pacific division.

Escatec Switzerland installed a customized UV-curing system to enhance its micro-assembly capabilities.

Mouser Electronics appointed Eric Wendt vice president of supplier management.

THE ROUTE
The Hidden Feature of AI Startups: A Much-Needed Human Touch
CAD as we know it for printed circuit design came into existence in the mid-1960s. And while some industry designers still remember the days (more fondly than I would!) of hand-taping components and traces, then using a camera to produce films for fabrication, it didn’t take too long before computers started taking over.

MIKE BUETOW

Mike Buetow






















TECHNICAL ARTICLES


Balancing Stackups and Circuitry
PCD&F/CIRCUITS ASSEMBLY



Soft Electronic Vias and Interconnects Through Rapid Three-Dimensional Assembly of Liquid Metal Microdroplets
Nature Electronics



Criteria for Solder Alloy Adoption
Journal of Surface Mount Technology

EVENTS

Nov. 6-8: Nepcon AsiaShenzhen, China
Nov. 13: PCB CarolinaRaleigh, NC
Nov. 28-30: GEIMS VietnamHanoi, Vietnam
Dec. 4-6: International Electronics Circuit Exhibition (Shenzhen)Shenzhen, China
Jan. 28-30: DesignConSanta Clara, CA
Feb. 6: SMTA Austin Expo & Tech ForumAustin, TX
April 29-May 2: PCB EastBoxborough, MA


 

BOOK-TO-BILLS/MARKET TRENDS
             Sept. Trend
EMS 1.26 Down
ICs TBD -
PCBs 1.08 Up
Component Sales Sentiment 98.8% Down
Changes are year-over-year.    

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ABOUT

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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