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April 25th, 2024
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
THE LEAD

The US government has now spent over half its $39 billion in Chips Act incentives, and US statistics show a stunning 15-fold increase in construction of manufacturing facilities for computing and electronics devices.

A pair of MIT-led research teams have been selected for NSF grants to develop sustainable topological materials, which have the potential to revolutionize next-generation microelectronics, and new materials, devices and manufacturing processes for chips that minimize energy consumption and use more commonly available materials.

TECH NEWS

The discounted price for the PCB East 2024 technical conference ends May 3, conference organizers said today.

Talks on supply chain-driven circuit design and embedded inductor technology highlight the PCEA Boston Chapter meeting on May 2 in Lowell, MA.

Thermoreflectance-based thermal imaging with its spatial and temporal resolution has proven to be an effective tool for gaining an understanding of the thermal behavior of advanced semiconductor and optoelectronic devices.

The three main approaches to 3D electronics -- applying electronics to a 3D surface, in-mold electronics, and fully printed 3D electronics -- are discussed in detail in the new IDTechEx report "3D Electronics/Additive Electronics 2024-2034: Technologies, Players, and Markets."

PCEA will host a pair of free technical talks on PCB design layout and land pattern generation as part of its meeting at the Del Mar Electronics Show on Wednesday, April 24.

PCB East 2024 features more than 80 hours of technical presentations, including an all-day forum on UHDI.

Beyond Neuralink, meet the other companies developing brain-computer interfaces.

Amphenol released its 2023 Sustainability Report.

The history of Pan Pac including the technologies introduced at the annual symposium are the topic of this week's Reliability Matters podcast.

MATERIAL GAINS
How Do We Power 5G Networks?
5G network capacity is predicted to increase as much as 1000-fold by 2030. That's a stunning increase that can be attributed to effects such as our digital lifestyles and digital business transformation. Clearly, our dependence on online services that are available anytime, anywhere and at full speed shows no sign of abating.

ALUN MORGAN

Alun Morgan





















BUSINESS NEWS

TTM Technologies has officially opened its $200 million, state-of-the-art PCB manufacturing plant in Penang.

Kitron reported revenue for the first quarter of EUR 173.9 million ($186.5 million), down from EUR 190.6 million last year.

Plexus announced fiscal second quarter revenue of $967 million, down 9.7% from a year ago on lower healthcare/life sciences and industrial demand, offset in part by higher demand for aerospace.

Omni Federal is expanding to Colorado Springs with plans for more than 500 high-paying jobs.

A pair of US Congressional members are calling on the Biden administration to block all sales to Huawei after the sanctioned Chinese tech company released a new laptop powered by an Intel AI processor.

Bendix will expand and upgrade its Indiana electronics manufacturing and distribution operations.

Electroninks, a maker of metal complex inks for additive manufacturing, announced the official opening of the company’s APAC facility in Kaohsiung City, Taiwan.

Eight new Chinese suppliers have been added to Apple's recently announced fiscal year 2023 supplier list, while four have been removed.

Nokia's optical line terminal (OLT) cards have officially started rolling off the Sanmina manufacturing line in Pleasant Prairie, WI.

The Semiconductor Industry Association applauded recent semiconductor manufacturing incentives announced by the US Department of Commerce and Micron.

DESIGNER'S NOTEBOOK
Designing for PCB Assembly
Printed circuit board assemblies animate a collection of components designed to do something useful. Joining those components on a board that completes the connections with a circuit pattern is the best solution we have to create modern electronic devices.

JOHN BURKHERT JR.

John Burkhert Jr.






















TECHNICAL ARTICLES


Preserving Solder Paste Integrity
PCD&F/CIRCUITS ASSEMBLY



PCB Defect Detection Algorithm Based on CDI-YOLO
Nature



End-To-End Material Thermal Conductivity Prediction Through Machine Learning
Journal of Applied Physics

EVENTS

May 7-9: CTMA Partners MeetingProvidence, RI
May 9: Advanced Manufacturing Conference & Line TourCounty Clare, Ireland
May 14-16: Electronics in Harsh Environments ConferenceCopenhagen, Denmark
May 28-29: New-Tech Exhibition 2024Tel Aviv, Israel
May 28-30: Semicon Southeast Asia 2024Kuala Lumpur, Malaysia
May 28-31: Electronic Components and Technology ConferenceDenver, CO
June 4-7: PCB East 2024Boxborough, MA
June 10-12: PCBAA Annual ConferenceWashington DC
June 14: Printed Circuit Engineering Professional (CPCD) ClassOnline
June 18-20: 2024 SMCBA Conference & ElectroneX ExpoSydney, Australia
Oct. 8-11: PCB West 2024Santa Clara, CA
Nov. 13: PCB CarolinaRaleigh, NC


SUBMISSIONS

Email industry press releases or links to the editors of PCD&F/CIRCUITS ASSEMBLY: pr@pcea.net.

 

BOOK-TO-BILLS/MARKET TRENDS
             Feb. Trend
EMS 1.22 Up
ICs16. 16.3% Up
PCBs 1.07 Up
Component Sales Sentiment 100.8% Up
Changes are year-over-year.    
ABOUT

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@pcea.net.


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