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April 19th, 2019
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

MacDermid Alpha introduces Alpha HiTech adhesives and encapsulants.

On the latest episode of Reliability Matters, Mike Konrad covers tips and tricks for successfully cleaning circuit assemblies.

On the PCB Chat podcast, Brad Griffin of Cadence speaks on a new electromagnetic (EM) simulation tool.

PCB2Day with Rick Hartley is coming to Chelmsford, MA, June 13 and 14. Register today.

Melanin-based electronics could turn sci-fi into reality.

Pros and Cons of Conductor Surface Roughness in RF Circuits
Conductor surface roughness directly interferes with conduction in high-frequency circuits. How is this?

Akber Roy



Foxconn’s chairman Terry Gou is stepping down from daily operations.

Wisconsin’s Governor Tony Evers is considering renegotiating the state’s agreement with Foxconn.

Plexus reported fiscal second quarter revenue of $789 million, up 13% year-over-year.

Worldwide IT spending is projected to total $3.8 trillion in 2019, an increase of 1.1% from 2018, according to Gartner.

The worldwide market for EMS is expected to grow at a CAGR of roughly 4.1% over the next five years, reaching $55 billion in 2024.

Shares of Ventec International began trading on the Taiwan Stock Exchange.

The 2019 Medical Electronics Symposium will be held May 21-22 in Cleveland, OH.

Kodiak Assembly Solutions is celebrating its 15th year in business.

Yamaha Motor’s Intelligent Machinery (IM) division announced the grand opening of its new sales, training and demonstration facility in Marietta, GA.

Founder PCB hired Richard Sun to lead its R&D Institute.

Sierra RF will represent Super PCB at two SMTA expos in May.

JW Corporation will represent BTU International in Canada.

TSMC expects to post consolidated revenues of between $7.55 billion and $7.65 billion in the second quarter of 2019, down 2.6-3.9% on year.

No Rest for the … HoP and HiP in BGAs
The terms head-on-pillow (HoP) and head-in-pillow (HiP) are used interchangeably to describe an open circuit failure of a BGA solder joint.

David Bernard



From the pages of
Printable and Flexible Electronics in Taiwan
I was invited to keynote the two-day conference of Printable & Flexible Electronics held at the Industrial Technology Research Institute (ITRI) in Taiwan.
by Dominique Numakura

From the pages of
Investigating the Metric 0201 Assembly Process
The feasibility of high-volume microminiature component manufacturing using Type 5 and 6 pastes.
by Clive Ashmore


May 1-2: Del Mar Electronics & Manufacturing Show, San Diego, CA
May 7-8: 2019 Technology Days, Erlanger, KY
May 8-9: Greater Chicago Design-2-Part Show, Schaumburg, IL
May 21-22: 2019 Medical Electronics Symposium, Cleveland, OH
June 13-14: PCB2Day with Rick Hartley, Chelmsford, MA
Sept. 9-11: PCB West, Santa Clara, CA
Sept. 22-26: SMTA International, Rosemont, IL
Nov. 12-15: Productronica, Munich, Germany


Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

           4/15/19 TREND
Sn $9.49 Down
Pb $0.89 Down
Ag $221.25 Up
Cu $2.92 Up
             Feb. TREND
Semi equip. billings -22.9% Down
ICs -10.6% Down
PCBs 1.06 Up

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

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