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January 18th, 2019
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

It’s not the cable that is the chief source of EMC test failures; it’s usually the connector.

Bowman rolls out G Series XRF.

Rogers launches RO3003G2 high-frequency laminates.

PCB WEST is accepting abstracts for the 2019 technical conference.

The ECIA updated its 2-D barcode labeling specification.

Master Bond is offering a white paper that explains the importance of low CTE adhesives.

Dk and Df Characterization Methods for PCB Laminates – Part I
If not for my parents’ objection, I would have been held back in kindergarten. Mrs. Steinbaugh said I just didn’t understand what school was all about.

Bill Hargin



Semiconductor growth will see a noticeable slowdown in 2019 and 2020, but the industry is still healthy over the longer term.

Plexus reported fiscal first quarter revenue of $765.5 million, up 13% year-over-year and down 0.73% sequentially.

TTM Technologies lowered its fiscal fourth quarter revenue guidance on slower demand for cars and phones.

If the scores of personal health care devices at the Consumer Electronics Show were any indication, it’s clear that the Apple Watch has kicked off a rush by high-tech companies to capitalize on people’s worries about their health.

Elite Material (EMC) expects to see 2019 revenue growth driven by robust demand from handset and automotive electronics sectors for its HDI laminate.

SMTC has been awarded a $9 million, five-year contract to support the US Naval Undersea Warfare Center Division.

MIRTEC appointed Kirby & Demarest manufacturers’ representative in Oregon, Washington, Idaho, Montana and British Columbia.

Z-Axis installed a PVA Delta 6 robotic dispenser.

Super Dry Totech named IPT distributor in Ireland.

Rehm named Julian Klaiber head of internal sales and Christoph Maier responsible for sales in southeast Germany.

Open Solder Joints on BTCs
The open solder joint on this BTC area array package was caused by poor paste volume control. The solder volume was not sufficient to create a joint.

Martin Wickham



From the pages of
Maxwell and Transmission Lines
The famous mathematician can guide our understanding of electrical signals.
by Ralph Morrison

From the pages of
As-Shipped vs. Mounted Height for BGA and LGA Packages
A methodology to calculate solder joint height is used to conduct a tolerance analysis on BGAs.
by Robert Darveaux, Howard Chen, Shaul Branchevsky and Mahendra Harsha


Jan. 23 and 24: Webinar: iNEMI Reuse and Recycling Metrics Project, Phase 2, Online
Jan. 29-31: IPC Apex 2019, San Diego, CA
Jan. 29-31: DesignCon, Santa Clara, CA
Feb. 5-7: MD&M West, Anaheim, CA
Apr. 17-18: PCB2Day, Seattle, WA
June 13-14: PCB2Day, Chelmsford, MA
Sept. 9-11: PCB West, Santa Clara, CA
Sept. 22-26: SMTA International, Rosemont, IL
Nov. 12-15: Productronica, Munich, Germany


Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

           1/14/19 TREND
Sn $9.13 Up
Pb $0.89 Flat
Ag $228.38 Up
Cu $2.66 Up
             Nov. TREND
Semi equip. billings -5.3% Down
ICs 9.8% Down
PCBs 1.01 Down

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

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