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February 21st, 2020
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend

XJTAG releases XJTAG 3.10 boundary scan.

nScrypt announced successful 3-D printing of Type IX solder and silicone adhesive dots in the 50-micron range.

Altium launches cloud-based A365 Viewer.

Z-Zero debuts Z-Planner Enterprise 2019.2 stackup planner.

SJ Innotech rolls out HP-520SII printer.

UP Media Group seeks abstracts for PCB West, to be held Sept. 8-11. The four-day technical conference and one-day exhibition will be held at the Santa Clara Convention Center.

Phil Zarrow will present a two-day SMT Assembly Boot Camp, a practical workshop on processes and materials used in through-hole and SMT, in Austin, TX, in June.

Susy Webb in June will lead Design Essentials for PCB Engineers, a two-day workshop covering parts placement, routing, fine-pitch BGAs, fanout, controlling impedance and high-frequency energy, and stack-up and power issues, in Austin, TX.

EnviroLeach Technologies announced positive preliminary results from comprehensive full-scale recycling tests conducted at its e-waste processing facility in Vancouver on over 60,000 lbs. of electronic components and PCBs supplied by Jabil.

HZO revealed that significant investments in R&D have resulted in the 22 patents and patent-pending filings throughout multiple jurisdictions, including the US, China, and Europe.

Preparing for Next-Gen Loss Requirements, Part 2
Here in Part 2 of the series, I’ll outline the means by which insertion-loss requirements are determined. In Part 3, I’ll suggest a better method for obtaining more accurate Df numbers without having to go to the trouble of building test boards.

BilL Hargin



The European Union unveiled plans to create a single market for data that will help its companies compete on the next round of tech innovations and curb the power of data giants such as Facebook and Google.

Many electronics plants in China are running at 20-30% capacity utilization due to strict travel and quarantine restrictions enforced by over 80 cities in China.

Foxconn is cautiously restarting production at its main plants in China and warned revenue will be hurt this year by the coronavirus epidemic.

Global shipments of PCs are expected to retreat in the first quarter as PC brands have slowed down their orders for ICs and related components due to the impacts of the coronavirus.

TTM opened its $15 million, state-of-the-art PCB manufacturing facility in Chippewa Falls, WI.

M&A activity in the EMS sector slipped slightly in 2019, falling two to a total of 29.

Nordson reported fiscal first quarter sales of $95 million, down 1% year-over-year.

Foxconn’s Terry Gou pledged to begin production at a long-delayed electronics plant in Wisconsin sometime this year.

CyberOptics reported sales of $16.9 million for the fourth quarter, down 6.6% year-over-year and up 36% sequentially.

Integrated Micro-Electronics reported 2019 revenues down 7% to $1.2 billion.

Ducommon Electronic Systems’ revenue for the fourth quarter rose 13% year-over-year to $96.3 million.

Worldwide spending on information and communications technology is expected to be $4.3 trillion in 2020, an increase of 3.6% over 2019, according to IDC.

Altium reported PCB-design-related revenue of $65.4 million for the half-year ended Dec. 31, an increase of 12% year-over-year.

Nano Dimension will voluntarily delist its ordinary shares from trading on the Tel Aviv Stock Exchange.

South African courts have suspended the liquidation process of Yekani Manufacturing’s R1 billion (US$66.7 million) EMS factory, according to reports.

Nano Dimension moved its headquarters for the Americas to Boca Raton, Florida.

MacroFab purchased an Austin American Technology Aqua Rose PCB cleaner.

Weller Tools promoted Dyan Reagan to West Regional Manager.

KeyTronic promoted Duane Mackleit to vice president of operations.

Solder Surface Deformation
This month we show the ball surface on area array packages where no solder joint was formed.

Bob Willis



From the pages of
The Case for Copper Pour on Routing Layers
Don’t be afraid of the ground.
by John Burkhert Jr.

From the pages of
U of I Researchers Demonstrate New Capability for Electronics Cooling Using Additive Manufacturing
Researchers at the University of Illinois at Urbana-Champaign have demonstrated a new type of air jet cooler that overcomes previous barriers to jet cooling systems. Using additive manufacturing, the researchers created an air jet cooling system in a single component that can direct high-speed air onto multiple electronics hot spots.
by University of Illinois


Feb. 24-27: 2020 FLEX/MEMS & Sensors Technical Congress, San Jose, CA
Apr. 27-30: Zuken Innovation World Americas 2020, Coronado, CA
May 12-13: Medical Electronics Symposium, Cleveland, OH
June 9-10: PCB2Day: SMT Assembly Boot Camp, Austin, TX
June 11-12: PCB2Day: Design Essentials for PCB Engineers, Austin, TX
Sept. 8-11: PCB West 2020, Santa Clara, CA
Sept. 27-Oct. 1: SMTA International 2020, Rosemont, IL


Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

           2/17/20 Trend
Sn $7.46 Up
Pb $0.84 Down
Ag $257.84 Down
Cu $2.60 Up
             Dec. Trend
Semi equip. billings 17.8% Up
ICs -5.5% Up
PCBs 1.09 Up
Computers/elec. products 5.49 Down

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

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