INEMI will hold a webinar next month to discuss a lifecycle assessment tool for greenhouse gas emissions of PCBs.

ZUKEN will hold a webinar on Oct. 12 to explore the technology requirements and implementation best practices behind stretchable circuits (stretch-rigid).

UP MEDIA GROUP will hold a workshop on controlling noise in PCBs featuring Rick Hartley in Chicago in October.

KURTZ ERSA is offering two-day selective solder training classes starting in October at its demo facility in Plymouth, WI.

MOLEX introduces Coeur CST high-current interconnect system.

SCS debuts PrecisionCoat automatic dispense valve changer.

DELL EMC has ended its contract with Celestica and will move production in-house here, according to reports.

TAIWANESE EXPORTS of electronics goods, including chips, memory, passive modules and PCBs, in August rose 8% sequentially and 9.6% annually to S$11.56 billion.

DATA I/O and DigiCert announced a partnership to enable secure provisioning of semiconductor devices for IoT applications on Data I/O’s SentriX Secure Provisioning System.

THE CONSORTIUM FOR ON-BOARD OPTICS (COBO) says a host of companies next week will display the first optical modules and related technology compliant with the group’s recently released specifications.

FOXCONN is expected to overtake TPV Technology to become the largest TV ODM in 2018, buoyed by increasing orders from Sharp, Sony and Vizio.

PCB FIRM Trackwise Designs reported fiscal 2018 sales rose 15%.

THE AUTOMOTIVE RADAR MARKET will grow at a 23% CAGR between 2016 and 2022.

LOGIC PD has been awarded ISO 9001:2015 and AS9100:2016/AS9100D for its manufacturing plants in Eden Prairie, MN, and Ciudad Juárez, Mexico.

SAKI selected Jayson Moy as general manager, Saki Asia Pacific.

From the pages of
PRINTED CIRCUIT DESIGN & FAB:
In the World PCB Rankings, Flex Shows Its Muscle
The annual list of the largest fabricators shows flex circuit makers are beginning to dominate.
by Dr. Hayao Nakahara

From the pages of
CIRCUITS ASSEMBLY:
Trends in Medical Device Technology
Next-generation devices will rely on 3-D interconnect technology and power “scavenging.”
by Donald Banks

EVENTS

Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by UP Media Group. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.