NOKIA BELL LABS ENGINEERS are developing a wearable armband that could be used to control smart-home devices with gestures.

NI released LabView 2018 platform software for test workflows.

PCB WEST announced registration is open for the 2018 technical conference and exhibition.

TECHCON offers TS2560 Series applicator guns.

UP MEDIA GROUP will hold workshops on controlling noise in PCBs featuring Rick Hartley in Raleigh, NC, in June and Chicago in October.

IMAPS-UK will hold a workshop on substrates for more demanding applications at the National Physical Laboratory on June 27.

A NEW PENTAGON REPORT warns that the supply chain for high-end electronics and rare materials is increasingly at risk, likely putting radar and electronic warfare capabilities in danger as the Department of Defense relies more on these items.

THE GREAT SINO-AMERICAN TRADE WAR OF 2018 has fizzled, at least for now. The tech supply chain is unhappy.

GREEN CIRCUITS AND POWER DESIGN SERVICES announced a merger of the two EMS companies.

NORDSON reported sales of advanced technology systems were up 7.4% year-over-year to $58.3 million in the second quarter.

TAIWANESE LEGISLATORS are reviewing amendments to the national Toxic Chemical Substances Control Act following a deadly fire at Chin Poon.

IC INSIGHTS raised its full-year spending growth forecast for semiconductor equipment to 14% from 8%.

NAPROTEK installed a Nordson Dage Quadra 5 x-ray inspection system.

PRINTED CIRCUITS added an Orbotech Paragon LDI and a Fusion 22 AOI.

IPC awarded Ventec a second IPC-4101 Qualified Products Listing (QPL).

RYDER INDUSTRIES appointed Kingslea Chan vice president of sales and marketing.

KOH YOUNG AMERICA has expanded its direct service and support team with nearly 10 industry veterans.

From the pages of
PRINTED CIRCUIT DESIGN & FAB:
Voltage in the GHz World
Understand what is happening to the energy moving around in a circuit board.
by Ralph Morrison

From the pages of
CIRCUITS ASSEMBLY:
Fundamentals and Benefits of Vapor Phase Reflow Soldering
Do the smaller machine footprint and thermal advantages offset increased voiding?
by Akber Roy

EVENTS

Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.