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July 19th, 2018
News and Resources for PCB Design, Fab and Assembly Professionals Subscribe •  Advertise •  PCD&F •  Circuits Assembly •  Tell A Friend
TECH NEWS

GOEPEL updates Scanflex II Cube JTAG/boundary scan controller.

MASTER BOND rolls out EP21ND-LP epoxy.

REGISTRATION for CIRCUITS ASSEMBLY’s 2019 NPI Awards is now open.

THE 27TH ANNUAL Service Excellence Awards honor companies for excelling in the critical area of customer service. Registration is open until Sept. 7.

VISIT PCB WEST in September, Silicon Valley’s largest conference and exhibition for PCB design, fabrication and assembly.

VIRTUAL INDUSTRIES offers Pen-Vac Kit.

ON THE FOREFRONT
ECTC Boasts Record Crowds, FO-WLP Sessions Overflow
The IEEE Electronics Components and Technology Conference (ECTC) welcomed a record crowd of more than 1,700 attendees to San Diego to discuss the latest trends in packaging and assembly.
JAN VARDAMAN

Jan Vardaman

 

















BUSINESS NEWS

FOXCONN plans to open a technology center in Eau Claire, Wisconsin, and create 150 jobs.

LIBRA INDUSTRIES partnered with CoPro Technologies on mechanical design and PCB layout services.

SONO-TEK reported fiscal first quarter sales of $2.7 million, up 8% year-over-year.

PCD&F opened registration for its 2019 NPI Awards.

THE SMT EQUIPMENT MARKET is expected to grow at a CAGR of 8.66% from 2018 to 2021.

UP MEDIA GROUP will hold a workshop on controlling noise in PCBs featuring Rick Hartley in Chicago in October.

CREATIVE ELECTRON appointed David Kruidhof sales manager.

GLOBAL SHIPMENTS of smartphones featuring 3D sensing technology are expected to top over 100 million units in 2018.

THE ASIA EMS market is expected to reach $45.5 trillion by 2025.

DEFECTS DATABASE
Gold Peeling
Peelable masking has been used in the past to protect gold key pads during soldering or from solder spitting during reflow, which leads to solder wetting spots on some terminals.
MARTIN WICKHAM

Martin Wickham

 


















TECHNICAL ARTICLES

From the pages of
PRINTED CIRCUIT DESIGN & FAB:
How to Ensure Your Design Complies with Complex Flex Circuit Design-for-Manufacturing Requirements
With multiple assemblers involved in most projects, how can you speed up the development process?
by Naoyuki Sugaya and Steve Watt


From the pages of
CIRCUITS ASSEMBLY:
Medical Electronics Cleaning 101: A Primer
New solvent technology in combination with vapor degreasing can meet rigorous reliability and environmental standards.
by Jay Tourigny

EVENTS

July 20: IPC Designers Council Silicon Valley Chapter Meeting, San Jose, CA
July 23-25: SMT - BGA - BTC Design & Manufacturing, Hillsboro, OR
Sept. 5-7: Semicon Taiwan, Taipei, Taiwan
Sept. 11-13: PCB West, Santa Clara, CA
Sept. 12-13: Southern California Design-2-Part Show, Long Beach, CA
Sept. 25: EMC UK 2018 Training Conference, Birmingham, UK
Oct. 10-11: Southeast Design-2-Part Show, Raleigh, NC
Oct. 25-26: PCB2Day - Control of Noise, EMI and Signal Integrity in High Speed Circuits and PCBs, Chicago, IL
Dec. 13-15: Semicon Japan, Tokyo, Japan


SUBMISSIONS

Email industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: pr@upmediagroup.com.

METALS PRICES
           7/16/18 TREND
Sn $8.90 Down
Pb $1.01 Down
Ag $233.10 Down
Cu $2.79 Down
     
 
BOOK-TO-BILLS
             May TREND
Semi equip. billings 19.2% Down
ICs 21% Up
PCBs 1.09 Up
Computers 5.43 Up
     

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ISSN 1555-7936, Copyright © 2018 UP Media Group Inc., PO Box 470, Canton, GA 30169. All rights reserved.
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